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圆满落幕|伊索(大连)出席2026无锡半导体展

发布日期:2026.09.14

第十四届半导体设备材料及核心部件展于2026年8月31日-9月2日在无锡成功举办。

The CSEAC 2026 was successfully held in Wuxi from August 31 to September 2, 2026.



刚刚结束的 CSEAC 2026 展会上,我们带着铠装热电偶、高温热电偶、红外测温仪及加热产品等核心产品,交出了一份扎实的“答卷”。

At the recently concluded CSEAC 2026, ISOTEMP delivered a solid 'report card' with its core products, including MI thermocouples, high-temperature thermocouples, infrared pyrometers, and heating products.

 


半导体先进制程对精密测控和厂务环境控制的要求极高。展会现场,我们接待了大量来自产业链上下游的专业观众。大家深入交流产品的适配性问题,探讨复杂工况下的温度控制与监测方案。这种务实的交流,让我们对行业一线的真实需求有了更精准的把握。

Advanced semiconductor manufacturing processes demand highly precise measurement and control, as well as stringent facility environment management. At the exhibition, we welcomed numerous professionals from across the industry chain. We engaged in in-depth discussions regarding product compatibility and explored temperature control and monitoring solutions for complex operating conditions. This pragmatic exchange has given us a more precise understanding of the actual needs on the front lines of the industry.

 

好产品是聊出来的,更是用出来的。感谢大家在展台前留下的宝贵建议,我们将把这些真实反馈带回研发中。深耕半导体配套,我们步履不停。期待明年 CSEAC 2027 苏州站,与大家再聚首!

Great products are not only talked into existence; they are refined through real-world application. Thank you to everyone who shared their valuable insights at our booth. We will be taking your authentic feedback back to our R&D team. As we continue to deepen our commitment to semiconductor supporting equipment, our journey never stops. We look forward to reuniting with you all at CSEAC 2027 in Suzhou!

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